ALSI LASER1205

Advanced Laser Dicing & Grooving System

The ALSI LASER1205 is a high-precision laser system designed for full-cut dicing and grooving of semiconductor wafers. Developed by ASMPT ALSI, this system integrates advanced laser technology with high-throughput capabilities, offering a reliable solution for demanding manufacturing environments.

Key Benefits of LASER1205

Ultra-Precise Dicing: Positional accuracy and reproducibility of <1.5 µm
Minimal Heat Impact: Heat Affected Zone (HAZ) <2 µm
Narrow Dicing Width: <12 µm for multi-beam processing on 100 µm silicon
High Throughput: Up to 50% faster than competing systems
Flexible Material Handling: Supports Si, SiC, GaAs, Ge, DAF, Mold, and more
Inline Vision & Kerf Check: Real-time monitoring “On-the-Fly”
Dual Cassette & Cleaning Stations: Continuous operation with minimal downtime

Applications

The LASER1205 is designed for a wide range of semiconductor processes:

Wafer Dicing: Thickness from 10 µm to 300 µm
Grooving & Trenching: For Low-K, PI, TEG, and other advanced materials
Multi-Beam Laser Processing: UV and IR configurations
Inline Vision & Monitoring: Ensures consistent quality and precision

Machine Configurations

Our LASER1205 laser machines are leading in quality and lower your Cost of Ownership. Our portfolio is addressed to the specific challenges of the markets, both for OSAT and #1 IDM companies. See below our four different machine configurations:

LASER1205 Dicing IR Machine
For non-Si materials like GaAs, Ge and SiaAI, the IR (infrared) multi-beam dicing machine is the laser tool to meet dicing specifications in an industrial production environment.

LASER1205 Dicing UV Plus Machine
The Ultraviolet (UV) Dicing plus machine is for dicing thin wafers. This laser tool is mostly used in markets with high die-strength requirements like the Power, IC or Memory industry.

LASER1205 Grooving UV Machine
An efficient tool to remove top-layers to clear the street prior to the Saw blade dicing or Plasma dicing step.

LASER1205 Grooving UV-USP Machine

With multi-beam matrix laser spot patterns, the Ultraviolet Ultrashort pulse machine is used for grooving, before blade or plasma dicing IC-Logir or Memory wafers.