The VI-Process is the most advanced use of the multi-beam concept. This process uses a combination of Multi-Beam patterns to achieve the highest die strength possible with today’s laser dicing processes. The superior V-Process for high top-side-die-strength is combined with an optimal balanced line of spots (I-Process) for efficient dicing and high back-side-die-strength. Together this becomes the VI-Process. This Multi-Beam dicing concept results in a consistent dicing depth while ensuring the full removal of bottom materials such as Si, DAF or Metal. Thanks to its precise dicing properties the tape is left intact for optimum results after stretching.