Process

ASMPT ALSI is the inventor of Multi-Beam laser dicing and grooving. The Multi-Beam laser dicing and grooving process is the technology with very low thermal impact while having a very high productivity. ALSI’s solutions enables you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.

Multi-Beam	Scribing	V-Process	VI-Process	UV Matrix	USP Matrix