Process

ASMPT ALSI is the inventor of Multi-Beam laser dicing and grooving. The Multi-Beam laser dicing and grooving process is the technology with very low thermal impact while having a very high productivity. ALSI’s solutions enables you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.

Multi-Beam
Scribing
V-Process
VI-Process
UV Matrix
USP Matrix

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