ASMPT is the inventor of Multi-Beam dicing. With more than 20 years of Multi-Beam laser process experience in high volume manufacturing many billions of parts have been processed. Utilizing the strength of the Multi-Beam process, low power per beam but using many beams to allow high material removal rate with a small (<3um) heat affected zone. The unique slider concept (wafer stepper concept) allows high accuracy and reproducibility. The IR Multi-Beam laser process has proven its value in semiconductor wafer singulations, resulting in the status of PoR for many GaAs products.