At ASMPT ALSI, we set the industry standards. As the inventor of our patented multi-beam laser dicing and grooving technology, we redefined wafer singulation with unrivaled low thermal impact resulting in best product quality and productivity.
Today, we are the trusted leader in SiC laser dicing for power semiconductors, helping drive the future of the automotive industry. Our cutting-edge solutions also power innovation across Advanced Packaging, Display Driver ICs (DDI), Power Amplifiers, Switches, LEDs, and VCSELs.
Discover how our breakthrough technologies can elevate your business and see our full range of Products & Solutions below.
The ALSI LASER1205 platform is specially developed for the separation and/or grooving of semiconductor wafers using laser energy. The LASER1205 delivers ultra-precise laser dicing and grooving technology for wafers and Advaced Packaging materials. The machine is available with 4 different configurations: Grooving UV-USP, Grooving UV, Dicing UV-Plus and Dicing-IR.
ALSI's Next generation Laser Platform LASER1206 is designed for Front end manufacturing. This fully automated platform can do multiple processes and recipes in a Class1000 clean environment. This machine is available with two different configurations: Grooving UV-USP and Grooving UV.
ASMPT ALSI is the inventor of multi-beam laser dicing and grooving wafers. All of the below processes are based on our multi-beam principle. This principle enables the semiconductor market to work more efficient, cutting at high speed in both forward and backward directions.
When a single beam laser cuts with acceptable speed, it generates too much heat damage on a wafer, impacting the quality. To improve the quality of the cut, less laser power has to be applied; however this reduces the cutting speed too much. Multiple beam cutting limits the local heat load sufficiently while it achieves a high removal rate. In this way, a high dicing quality and high speed is combined.
Multiple processesses.
With the multibeam technology in our machines we enable the semiconductor industry to do:
ASMPT Coating.
Our ASMPT coatings protect and shield semiconductor materials during laser UV-grooving and UV-dicing. We offer six types of coating (excellent and premium coatings) with different viscosity for the perfect application fit. The water based coating has a thickness of typically up to -6.5µm. All coatings are compatible with our Coating & Cleaning station and Coating Drying station and are available in cans of 5, 10 or 20 liter.