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Printed Circuit Board (PCB)
Diameter: 200 mm
Wafer material: Substrate
Thickness: 0.25 mm
Die pitch: 3mm x 4mm
Street width: 465 µm
Results
Process : Dicing-UV-ns # T + MB
Dicing width: 50 µm
Burr height: <11 µm
UPH : 1.0