MPU-CPU: Silicon (Si >200µm)

• Diameter: 300 mm
• Wafer material: Si
• Thickness: 10 µm Al/Ti/SiO2/SiN – 290 µm Si – 20 µm DAF
• Die pitch: 2780 µm x 3196 µm
• Street width: 80 µm

Results

• Process : Dicing-UV-ns # VI-Process
• Modification width: 64 – 67 µm
• Outer width: 54 – 57 µm
• Inner width: 51 – 53 µm
• Groove depth: > 15 µm
• Burr height: 2 µm (non-metal area), 6 µm (metal area)
• UPH : 1.5