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LED (bonded): AISi (150 – 200μm)
Diameter: 150 mm
Wafer material: AlSi
Thickness: 200 µm
Die pitch: 360 µm x 360 µm
Street width: 30 µm
Results
Dicing-UV-ns # MB
Kerf Width : 8 – 10 µm
Burr height: 10 µm
UPH : 0.9