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Glass (50 – 100μm)
Diameter: 150 mm
Wafer material: Glass
Thickness: 100 µm
Die pitch: 7500 µm x 7500 µm
Street width: NA
Results
Process : Dicing-UV-ns # MB
Kerf width: 14 µm
Dicing width: 180 µm
Burr height: NA
UPH : NA