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BAW-Filters: Silicon (100μm – 150μm)
Diameter: 200 mm
Wafer material: Si
Thickness: 135 µm
Die pitch: 1100 µm x 700 µm
Street width: 60 µm
Results
Process : Dicing-UV-ns # MB
Kerf Width : 13 µm
Dicing width: 35 µm
Burr height: < 4 µm
UPH : 3.3