ALSI LASER1206

Next generation laser dicing & grooving system

Are you looking for the perfect platform for developing new process solutions for Advanced Packaging or Power Automotive applications? ASMPT ALSI’s LASER1206 platform includes advanced laser technology that brings you to the next step of your chip manufacturing process.

Features & Benefits

Key-features of LASER1206

Multi-beam Advanced Laser Technology included: limited local heat load offers the best possible process quality & high die strength.
Dicing & Grooving capability for High volume manufacturing.
Fully automated film frame and bare wafer handling capability.
Including wafer coating & cleaning and wafer coating drying station.
Clean mini-environment (Class 1000) Guarantee: closed doors between every process module.

Applications

The LASER1206 supports multiple semiconductor processes and materials:

UV-Dicing Plus
- Materials: Low-K, PI, Si, SiC, GaN, GaAs, TEG, BSM, Mold, DAF, NCF
- Wafer Thickness: 20–200 µm
- Processes: V-DOE dicing, trenching, deep scribe
UV-USP-Grooving
- Materials: Low-K, PI, TEG
- Wafer Thickness: 60–800 µm
- Processes: Trenching, grooving, deep scribe

The most versatile Laser Dicing & Grooving platform

The Fully Automated ALSI LASER1206 platform handles film framed wafers or bare wafers in a clean environment. The platform eliminates thermal damage that leads to burr formation. It’s therefore an essential tool to use as pre-process for Plasma Dicing and other next generation wafer processing methods.

Product Catalog

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