Silicon Carbide (150μm)

  • Diameter: 150 mm
  • Wafer material: SiC
  • Thickness: 150 µm
  • Die pitch: 2100 µm x 2400 µm
  • Street width: 80 µm

Results

  • Dicing width: ~33 µm
  • Burr height: < 5 µm
  • Productivity: 1.7 wafers per hour

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