Silicon (790μm)

• Diameter: 300 mm
• Wafer material: Si
• Thickness: 790 µm
• Die pitch: 4279 µm x 12284 µm
• Street width: 73 µm

Results

• Modification width: 50.4 µm
• Outer width: 44.3 µm
• Inner width: 37.1 µm
• Groove depth: > 14.5 µm from PI layer
• Burr height: < 5 µm
• Productivity: 7 wafers per hour