Silicon (790μm)

  • Diameter: 300 mm
  • Wafer material: Si
  • Thickness: 790 µm
  • Die pitch: 4279 µm x 12284 µm
  • Street width: 73 µm

Results

  • Modification width: 50.4 µm
  • Outer width: 44.3 µm
  • Inner width: 37.1 µm
  • Groove depth: > 14.5 µm from PI layer
  • Burr height: < 5 µm
  • Productivity: 7 wafers per hour

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