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Silicon (790μm)
Diameter: 300 mm
Wafer material: Si
Thickness: 790 µm
Die pitch: 4279 µm x 12284 µm
Street width: 73 µm
Results
Modification width: 50.4 µm
Outer width: 44.3 µm
Inner width: 37.1 µm
Groove depth: > 14.5 µm from PI layer
Burr height: < 5 µm
Productivity: 7 wafers per hour