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Sapphire Scribing
Diameter: 100 mm
Wafer material: Sapphire
Thickness: 130 µm
Die pitch: 218 µm x 218 µm
Street width: blank
Results
Kerf width: 4 µm
Scribing depth: 15 µm
Scribing width: 10 µm
Productivity: > 12 wafers per hour