Sapphire Scribing

  • Diameter: 100 mm
  • Wafer material: Sapphire
  • Thickness: 130 µm
  • Die pitch: 218 µm x 218 µm
  • Street width: blank

Results

  • Kerf width: 4 µm
  • Scribing depth: 15 µm
  • Scribing width: 10 µm
  • Productivity: > 12 wafers per hour

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