Sapphire (50 – 100μm)

  • Diameter: 150 mm
  • Wafer material: Sapphire
  • Thickness: 60 µm
  • Die pitch: 2220 µm x 4790 µm
  • Street width: 100 µm

Results

  • Kerf width: 5 µm
  • Dicing width : < 15 µm
  • Burr height : < 5 µm

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