Sapphire (150 – 200µm)

  • Diameter: 150 mm
  • Wafer material: Sapphire
  • Thickness: 200 µm
  • Die pitch: 412 µm x 1062 µm
  • Street width: 72 µm

Results

  • Kerf width: 9 µm
  • Dicing width : 22 µm
  • UPH : 0.4

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