Logic: Si (280µm)

Wafer

  • Diameter: 300 mm
  • Wafer material: Si
  • Thickness: 780 µm
  • Die pitch: 4470 µm x 4950 µm
  • Street width: 65 µm

Results and benefits

  • Modification width: 50 µm
  • Outer width: 45 µm
  • Inner width: 30 µm
  • Groove depth: 11.5 µm
  • Burr height: <4 µm max

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