LED (bonded): AISi (150 – 200μm)

  • Diameter: 150 mm
  • Wafer material: AlSi
  • Thickness: 200 µm
  • Die pitch: 360 µm x 360 µm
  • Street width: 30 µm

Results

  • Dicing-UV-ns # MB
  • Kerf Width : 8 – 10 µm
  • Burr height: 10 µm
  • UPH : 0.9

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