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  • Diameter: 100 mm
  • Wafer material: InP
  • Thickness: 100 µm
  • Die pitch: 250 µm x 250 µm
  • Street width: 10 x 40 µm

Results

  • Kerf width: 6 µm
  • Dicing width : < 14 µm
  • Burr height : < 8 µm
  • UPH : 5.5

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