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  • Diameter: 75 mm
  • Wafer material: InP
  • Thickness: 150 µm
  • Die pitch: 350 µm x 350 µm
  • Street width: 40 µm

Results

  • Dicing width : < 21 µm
  • Burr height : < 3 µm
  • UPH : 3.6

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