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Hi-Chiplets: Mold compound (200μm >)

  • Diameter: 200 mm
  • Wafer material: mold
  • Thickness: 650 µm
  • Die pitch: 2600 µm x 1600 µm
  • Street width: 1020 µm

Results

  • Process : Dicing-UV-ns # MB
  • Dicing width : 90 µm
  • UPH : 8

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