Glass (50 – 100μm)

  • Diameter: 150 mm
  • Wafer material: Glass
  • Thickness: 100 µm
  • Die pitch: 7500 µm x 7500 µm
  • Street width: NA

Results

  • Process : Dicing-UV-ns # MB
  • Kerf width: 14 µm
  • Dicing width: 180 µm
  • Burr height: NA
  • UPH : NA