Display Drivers: Si (780 µm)

Wafer

  • Diameter: 300 mm
  • Wafer material: Si
  • Thickness: 780 µm
  • Die pitch: 32800 µm x 1160 µm
  • Street width: 80 µm

Results and benefits

  • Modification width: 60 µm
  • Outer width: 55 µm
  • Inner width: 49 µm
  • Groove depth: 5 ~ 7 µm
  • Burr height: 1.5 µm max

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