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BAW-Filters: Silicon (100μm – 150μm)

  • Diameter: 200 mm
  • Wafer material: Si
  • Thickness: 135 µm
  • Die pitch: 1100 µm x 700 µm
  • Street width: 60 µm

Results

  • Process : Dicing-UV-ns # MB
  • Kerf Width : 13 µm
  • Dicing width: 35 µm
  • Burr height: < 4 µm
  • UPH : 3.3

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